PRODUCT PROMISE

High tech in small form: 

✔ Special stack-up help/NPI review 

✔ Up to 30 layers 

✔ Files evaluated by engineers 

✔ Quote sent by email within a few hours

HDI features:

✔ HDI features: Down to 1.5-mil trace space, 2-mil holes

✔ Blind vias, buried vias, and other microvia techniques 

✔ Built-up laminations and high-signal performance considerations 

✔ Laser direct imaging 

✔ Fine lines and via-in-pad technology 

✔ Metal-core Flex / rigid-flex

Via capabilities for HDI PCBs

Fabrication parameters for HDI PCBs

Drill parameters for HDI PCBs